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FDT86113LZ Datasheet(PDF) 2 Page - Fairchild Semiconductor

Part # FDT86113LZ
Description  N-Channel PowerTrench짰 MOSFET 100 V, 3.3 A, 100 m
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDT86113LZ Datasheet(HTML) 2 Page - Fairchild Semiconductor

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FDT86113LZ Rev.C
www.fairchildsemi.com
2
Electrical Characteristics T
J = 25 °C unless otherwise noted
Off Characteristics
On Characteristics (Note 2)
Dynamic Characteristics
Switching Characteristics
Drain-Source Diode Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
BVDSS
Drain to Source Breakdown Voltage
ID = 250 PA, VGS = 0 V
100
V
'BVDSS
'TJ
Breakdown Voltage Temperature
Coefficient
ID = 250 PA, referenced to 25 °C
71
mV/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 80 V, VGS = 0 V
1
PA
IGSS
Gate to Source Leakage Current
VGS = ±20 V, VDS = 0 V
±10
PA
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250 PA
1.0
1.7
2.5
V
'VGS(th)
'TJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250 PA, referenced to 25 °C
-5
mV/°C
rDS(on)
Static Drain to Source On Resistance
VGS = 10 V, ID = 3.3 A
75
100
m
:
VGS = 4.5 V, ID = 2.7 A
95
145
VGS = 10 V, ID = 3.3 A,
TJ = 125 °C
140
189
gFS
Forward Transconductance
VDS = 10 V, ID = 3.3 A
8
S
Ciss
Input Capacitance
VDS = 50 V, VGS = 0 V,
f = 1 MHz
234
315
pF
Coss
Output Capacitance
46
65
pF
Crss
Reverse Transfer Capacitance
3.1
5
pF
td(on)
Turn-On Delay Time
VDD = 50 V, ID = 3.3 A,
VGS = 10 V, RGEN = 6 :
3.8
10
ns
tr
Rise Time
1.3
10
ns
td(off)
Turn-Off Delay Time
10
20
ns
tf
Fall Time
1.5
10
ns
Qg
Total Gate Charge
VGS = 0 V to 10 V
VDD = 50 V,
ID = 3.3 A
4.1
6.8
nC
Qg
Total Gate Charge
VGS = 0 V to 5 V
2.3
3.9
nC
Qgs
Gate to Source Gate Charge
0.68
nC
Qgd
Gate to Drain “Miller” Charge
0.85
nC
VSD
Source to Drain Diode Forward Voltage
VGS = 0 V, IS = 3.3 A
(Note 2)
0.86
1.3
V
VGS = 0 V, IS = 1 A
(Note 2)
0.77
1.2
trr
Reverse Recovery Time
IF = 3.3 A, di/dt = 100 A/Ps
31
49
ns
Qrr
Reverse Recovery Charge
21
34
nC
Notes:
1. RTJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RTJC is guaranteed by design while RTJA is determined by the user’s board design.
2. Pulse Test: Pulse Width < 300
Ps, Duty cycle < 2.0%.
3. Starting TJ = 25°C, L = 0.3 mH, IAS = 8 A, VDD = 90 V, VGS = 10 V.
4. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
55 °C/W when mounted on a
1 in2 pad of 2 oz copper
a)
118 °C/W when mounted on
a minimum pad of 2 oz copper
b)


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