January 2012

©2012 Fairchild Semiconductor Corporation

FDMA7632 Rev.C1

www.fairchildsemi.com

1

FDMA7632

30 V, 9 A, 19 m

Ω

Features

Low Profile - 0.8 mm maximum - in the new package

MicroFET 2x2 mm

Free from halogenated compounds and antimony oxides

RoHS compliant

General Description

This device has been designed to provide maximum efficiency

and thermal performance for synchronous buck converters. The

performance.

Application

DC – DC Buck Converters

D

D

S

G

D

D

Pin 1

Drain

Source

MicroFET 2X2 (Bottom View)

5

1

6

2

3

4

D

D

S

D

D

G

Bottom Drain Contact

Thermal Characteristics

Package Marking and Ordering Information

Symbol

Parameter

Ratings

Units

Drain to Source Voltage

30

V

Gate to Source Voltage

±20

V

Drain Current -Continuous

(Note 1a)

9

A

-Pulsed

24

Power Dissipation

(Note 1a)

2.4

W

Power Dissipation

(Note 1b)

0.9

Operating and Storage Junction Temperature Range

–55 to +150

°C

Thermal Resistance, Junction to Ambient

(Note 1a)

52

°C/W

Thermal Resistance, Junction to Ambient

(Note 1b)

145

Device Marking

Device

Package

Reel Size

Tape Width

Quantity

632

FDMA7632

MicroFET 2x2

7 ’’

12 mm

3000 units