© 2011 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN48630 • Rev. 1.0.1

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above

the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended

exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings

are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

VIN Input Voltage

-0.3

6.5

V

6.0

V

SW Node

DC

-0.3

8.0

V

Transient: 10 ns, 3 MHz

-1.0

8.0

V

Other Pins

-0.3

6.5

(3)

V

ESD

Electrostatic Discharge

Protection Level

Human Body Model per JESD22-A114

3.0

kV

Charged Device Model per JESD22-C101

1.5

kV

Junction Temperature

–40

+150

°C

Storage Temperature

–65

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

Note:

3.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating

conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding

them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

2.35

5.50

V

Output Current

0

1500

mA

Ambient Temperature

–40

+85

°C

Junction Temperature

–40

+125

°C

Thermal Properties

Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer

Symbol

Parameter

Typical

Unit

Junction-to-Ambient Thermal Resistance

80

°C/W

Junction-to-Board Thermal Resistance

42