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SPXN1010VLU120R Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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SPXN1010VLU120R Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 130 page  Freescale Semiconductor Data Sheet: Technical Data Document Number: PXD10 Rev. 1, 09/2011 PXD10 416 TEPBGA 27 mm x 27 mm 176 LQFP 24 mm x 24 mm 208 LQFP 28 mm x 28 mm © Freescale Semiconductor, Inc., 2011. All rights reserved. The PXD10 family represents a new generation of 32-bit microcontrollers based on the Power Architecture®. These devices provide a cost-effective, single chip display solution for the industrial market. An integrated TFT driver with digital video input ability from an external video source, significant on-chip memory, and low power design methodologies provide flexibility and reliability in meeting display demands in rugged environments. The advanced processor core offers high performance processing optimized for low power consumption, operating at speeds as high as 64 MHz. The family itself is fully scalable from 512 KB to 1 MB internal flash memory. The memory capacity can be further expanded via the on-chip QuadSPI serial flash controller module. The PXD10 family platform has a single level of memory hierarchy supporting on-chip SRAM and flash memories. The 1 MB flash version features 160 KB of on-chip graphics SRAM to buffer cost effective color TFT displays driven via the on-chip Display Control Unit (DCU). See Table 1 for specific memory size and feature sets of the product family members. The PXD10 family benefits from the extensive development infrastructure for Power Architecture devices, which is already well established. This includes full support from available software drivers, operating systems, and configuration code to assist with users’ implementations. See Section 3, Developer support, for more information. PXD10 Microcontroller Data Sheet 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.3 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.4 PXD10 series blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.5 PXD10 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.6 Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Pinout and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 27 2.1 144 LQFP package pinouts . . . . . . . . . . . . . . . . . . . . . 27 2.2 176 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . 29 2.3 Pad configuration during reset phases . . . . . . . . . . . . . 30 2.4 Voltage supply pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.5 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.6 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2.7 Debug pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2.8 Port pin summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 3.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 55 3.3 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 3.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 57 3.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 62 3.6 Electromagnetic compatibility (EMC) characteristics . . 65 3.7 Power management electrical characteristics . . . . . . . 67 3.8 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . 75 3.9 SSD specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 3.10 RESET electrical characteristics . . . . . . . . . . . . . . . . . 84 3.11 Fast external crystal oscillator (4–16 MHz) electrical characteristics87 3.12 Slow external crystal oscillator (32 KHz) electrical characteristics89 3.13 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . 91 3.14 Fast internal RC oscillator (16 MHz) electrical characteristics 92 3.15 Slow internal RC oscillator (128 kHz) electrical characteristics92 3.16 Flash memory electrical characteristics . . . . . . . . . . . . 93 3.17 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 94 3.18 LCD driver electrical characteristics . . . . . . . . . . . . . . 101 3.19 Pad AC specifications. . . . . . . . . . . . . . . . . . . . . . . . . 102 3.20 AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . 122 4.1 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 4.2 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 5 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 |
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