© 2010 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA8009 • Rev. 1.0.1

7

Physical Dimensions

Figure 3. 10-Lead UMLP Package Drawing

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most

recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which

covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

Ordering Information

Part Number

Operating Temperature Range

Top Mark

Package

FSA8009UMX

-40 to +85°C

KP

10-Lead 1.4 x 1.8 x 0.55mm, 0.4mm Pitch,

Ultrathin Molded Leadless Package (UMLP)

A

B

C

SEATING

PLANE

DETAIL A

PIN#1 IDENT

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP10Arev3.

TOP VIEW

BOTTOM VIEW

0.15 C

0.08 C

0.15 C

2X

2X

SIDE VIEW

0.10 C

0.05

3

6

1

0.10 C A B

0.05 C

0.55 MAX.

10

1.40

1.80

0.40

0.15

0.25

(10X)

0.35

0.45

(9X)

1.70

2.10

0.40

0.663

0.563

(9X)

0.225

(10X)

1

0.152

0.10

0.10

0.55

0.45

0.10

DETAIL A

SCALE : 2X

1.85

1.45

0.55

0.40

0.225

(10X)

9X

0.45

PIN#1 IDENT

OPTIONAL MINIMIAL

TOE LAND PATTERN

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

PACKAGE

EDGE