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THT-13-457-10 Datasheet(PDF) 5 Page - Texas Instruments |
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THT-13-457-10 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 17 page www.ti.com Board Layout The thermal resistance for the TPS7A4700EVM-094 is the measured value for this particular layout scheme. The maximum power dissipation is proportional to the volume of copper volume connected to the package. 6 Board Layout Figure 3. Assembly Layer 5 SLVU741 – May 2012 TPS7A4700EVM-094 Evaluation Module Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated |
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