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MAX15090A Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX15090A Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 15 page 2 Maxim Integrated MAX15090/MAX15090A 2.7V to 18V, 12A, Hot-Swap Solution with Current Report Output VCC to GND...........................................................-0.3V to +20V IN to GND..............................................................-0.3V to +20V OUT to GND...............................................-0.3V to (VIN + 0.3V) GATE to OUT...........................................................-0.3V to +6V CDLY, ISENSE to GND ...........................-0.3V to (VREG + 0.3V) EN, CB, UV, OV to GND .........................................-0.3V to +6V REG to GND............................-0.3V to min (+6V, (VCC + 0.3V)) PG, FAULT to GND ...............................................-0.3V to +20V Continuous Power Dissipation (TA = +70NC) WLP (derate 23.8mW/NC above +70NC) ....................1500mW Operating Temperature Range.......................... -40NC to +85NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -60NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC Junction-to-Ambient Thermal Resistance ( qJA) ..............42°C/W Junction-to-Case Thermal Resistance ( qJC).....................7°C/W ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Thermal resistance can be lowered with improved board design. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) ELECTRICAL CHARACTERISTICS (VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 33.2kω, and TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES VCC Operating Range VCC 2.7 18 V IN Operating Range VIN 2.7 18 V VCC Supply Current ICC VIN = 3V 0.5 0.75 mA IN Supply Current IIN RCB = 40.2kω, no load 5.1 6.2 mA RCB = 10kω, no load 1.4 1.8 VCC Default Undervoltage Lockout VUVLO VCC rising 2.35 2.5 2.65 V VCC Default Undervoltage- Lockout Hysteresis VUVLO_HYS 0.1 V REG Regulator Voltage VREG No load, VCC > 4V 3.15 3.35 3.55 V UV Turn-On Threshold VUV_TH VUV rising 1.21 1.23 1.25 V UV Turn-On Threshold Hysteresis VUV_HYS VUV falling 0.1 V OV Turn-On Threshold VOV_TH VOV rising 1.21 1.23 1.25 V OV Turn-On Threshold Hysteresis VOV_HYS VOV falling 0.1 V EN Threshold VEN_TH VEN rising 0.95 1 1.05 V EN Threshold Hysteresis VEN_HYS VEN falling 0.1 V |
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