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MAX2022 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX2022 Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 20 page  Maxim Integrated │ 2 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator www.maximintegrated.com DC Electrical Characteristics (MAX2022 Typical Application Circuit, VCC=4.75Vto5.25V,VGND=0V,I/Qportsterminatedinto50ΩtoGND,LOandRFports terminatedinto50ΩtoGND,R1=432Ω,R2=562Ω,R3=301Ω,TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25°C, unless otherwise noted.) Recommended AC Operating Conditions VCC_toGND.......................................................-0.3V to +5.5V BBIP,BBIN,BBQP,BBQNtoGND .......... -2.5V to (VCC + 0.3V) LO,RFtoGNDMaximumCurrent.....................................50mA RF Input Power ..............................................................+20dBm Baseband Differential I/Q Input Power...........................+20dBm LO Input Power ..............................................................+10dBm RBIASLO1 Maximum Current ............................................10mA RBIASLO2 Maximum Current ............................................10mA RBIASLO3 Maximum Current ............................................10mA Continuous Power Dissipation (Note 1) ..............................7.6W Operating Case Temperature Range (Note 2) ... -40°C to +85°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range............................ -65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow).......................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics TQFN Junction-to-Ambient ThermalResistance(θJA) (Notes 3, 4) .....................+34°C/W Junction-to-Case ThermalResistance(θJC) (Notes 1, 4) ....................+8.5°C/W Absolute Maximum Ratings Note 1: Based on junction temperature TJ = TC+(θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Note 3: Junction temperature TJ = TA+(θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 4: PackagethermalresistanceswereobtainedusingthemethoddescribedinJEDECspecificationJESD51-7,usingafour-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VCC 4.75 5.00 5.25 V Total Supply Current ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC 292 342 mA Total Power Dissipation 1460 1796 mW PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency (Note 5) fRF 1500 3000 MHz LO Frequency (Note 5) fLO 1500 3000 MHz IF Frequency (Note 5) fIF 1000 MHz LO Power Range PLO -3 +3 dBm |
Similar Part No. - MAX2022_12 |
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Similar Description - MAX2022_12 |
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