Revised: October 9, 2012

POLY-FUSE

© 2012 Littelfuse, Inc.

Lo Rho Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/LoRho.html for current information.

Temperature Rerating Curve

-40

-30

-20

-10

0

10

20

30

40

5060

70

80

10%

30%

50%

70%

90%

110%

130%

150%

170%

Temperature (°C)

Environmental Specifications

Operating Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped State

125°C

Passive Aging

+85°C, 1000 hours

-/+10% typical resistance change

Humidity Aging

+85°C, 85% R.H.,100 hours

-/+15% typical resistance change

Thermal Shock

MIL–STD–202, Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215

No change

Vibration

MIL–STD–883C, Method 2007.1,

Condition A No change

Moisture Sensitivity Level

Level 1, J–STD–020C

Physical Specifications

Terminal Material

Solder-Plated Copper

(Solder Material: Matte Tin (Sn))

Lead Solderability

Meets EIA Specification RS186-9E,

ANSI/J-STD-002, Category 3.

Soldering Parameters

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (T

3°C/second max

Pre Heat:

Temperature Min (T

150°C

Temperature Max (T

200°C

Time (Min to Max) (t

60 – 180 secs

Time Maintained

Above:

Temperature (T

217°C

Temperature (t

60 – 150 seconds

Peak / Classification Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reflow temperature exceeds the recommended profile, devices may not meet the

performance requirements

-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N

2

environment for lead

-- Recommended maximum paste thickness is 0.25mm (0.010 inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices