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EMIF02-MIC06F3 Datasheet(PDF) 5 Page - STMicroelectronics |
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EMIF02-MIC06F3 Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 8 page EMIF02-MIC06F3 Ordering information scheme Doc ID 15195 Rev 4 5/8 2 Ordering information scheme Figure 11. Ordering information scheme 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. Flip Chip package dimensions EMIF yy - xxx zz Fx EMI filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version F = Flip Chip x = 3: lead-free, pitch = 400 µm 1.20 mm ± 30 µm 255 µm ± 40 200 µm 400 µm ± 40 605 µm ± 55 |
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