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PS21963-4ES Datasheet(PDF) 3 Page - Mitsubishi Electric Semiconductor |
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PS21963-4ES Datasheet(HTML) 3 Page - Mitsubishi Electric Semiconductor |
3 / 8 page MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module> PS21963-4ES TRANSFER-MOLD TYPE INSULATED TYPE Mar. 2007 3 2.20 2.30 2.35 1.70 — 0.60 2.00 0.75 1 10 4.1 5.4 mA V Tj = 25°C Tj = 125°C IC = 8A, Tj = 25°C IC = 8A, Tj = 125°C VCE(sat) VEC ton trr tc(on) toff tc(off) ICES Condition Symbol Parameter Limits Inverter IGBT part (per 1/6 module) Inverter FWD part (per 1/6 module) Rth(j-c)Q Rth(j-c)F Min. THERMAL RESISTANCE Typ. Max. — — — — Unit Tj = 25°C, –IC = 8A, VIN = 0V Condition Symbol Parameter Limits Min. Typ. Max. — — — 0.60 — — — — — — Unit ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise noted) INVERTER PART Collector-emitter saturation voltage FWD forward voltage Junction to case thermal resistance (Note 3) VD = VDB = 15V VIN = 5V Switching times VCC = 300V, VD = VDB = 15V IC = 8A, Tj = 125°C, VIN = 0 ↔ 5V Inductive load (upper-lower arm) Collector-emitter cut-off current VCE = VCES 1.70 1.80 1.90 1.10 0.30 0.40 1.40 0.40 — — V µs µs µs µs µs °C/W °C/W CONTROL (PROTECTION) PART Note 4 : Short circuit protection is functioning only for the lower-arms. Please select the external shunt resistance such that the SC trip-level is less than 1.7 times of the current rating. 5: Fault signal is asserted corresponding to a short circuit or lower side control supply under-voltage failure. Symbol ID VFOH VFOL VSC(ref) IIN UVDBt UVDBr UVDt UVDr tFO Vth(on) Vth(off) Vth(hys) Parameter Condition Limits Unit Circuit current Fault output voltage Short circuit trip level Control supply under-voltage protection Fault output pulse width ON threshold voltage OFF threshold voltage ON/OFF threshold hysteresis voltage VD = VDB = 15V VIN = 5V Total of VP1-VNC, VN1-VNC VUFB-U, VVFB-V, VWFB-W VSC = 0V, FO terminal pull-up to 5V by 10kΩ VSC = 1V, IFO = 1mA Tj = 25°C, VD = 15V (Note 4) VIN = 5V Trip level Reset level Trip level Reset level (Note 5) Applied between UP, VP, WP, UN, VN, WN-VNC — — — — 4.9 — 0.43 0.70 10.0 10.5 10.3 10.8 20 — 0.8 0.35 — — — — — — 0.48 1.00 — — — — — 2.1 1.3 0.65 2.80 0.55 2.80 0.55 — 0.95 0.53 1.50 12.0 12.5 12.5 13.0 — 2.6 — — Min. Typ. Max. mA V V V mA V V V V µs V V V VD = VDB = 15V VIN = 0V Total of VP1-VNC, VN1-VNC VUFB-U, VVFB-V, VWFB-W Tj ≤ 125°C Note 3 : Grease with good thermal conductivity should be applied evenly with about +100µm~+200µm on the contacting surface of DIP-IPM and heat-sink. The contacting thermal resistance between DIP-IPM case and heat sink (Rth(c-f)) is determined by the thickness and the thermal conductivity of the applied grease. For reference, Rth(c-f) (per 1/6 module) is about 0.3°C/W when the grease thickness is 20µm and the thermal conductivity is 1.0W/m·k. Input current |
Similar Part No. - PS21963-4ES_09 |
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Similar Description - PS21963-4ES_09 |
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