TMP87P809

II

2008-03-06

1. Part number

2. Package code and dimensions

Previous Part Number

(in Body Text)

Previous Package Code

(in Body Text)

New Part Number

New Package Code

OTP

TMP87P809N

P-SDIP28-400-1.78

TMP87P809NG

SDIP28-P-400-1.78

—

TMP87P809M

P-SOP28-450-1.27

TMP87P809MG

SOP28-P-450-1.27B

—

3. Addition of notes on lead solderability

The following solderability test is conducted on the new device.

Lead solderability of Pb-free devices (with the G suffix)

Test

Test Conditions

Remark

Solderability

(1) Use of Lead (Pb)

·

solder bath temperature

= 230°C

·

dipping time

= 5 seconds

·

the number of times

= once

·

use of R-type flux

(2) Use of Lead (Pb)-Free

·

solder bath temperature

= 245°C

·

dipping time

= 5 seconds

·

the number of times

= once

·

use of R-type flux

Leads with over 95% solder coverage

till lead forming are acceptable.

4. RESTRICTIONS ON PRODUCT USE

The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text.

5. Publication date of the datasheet

The publication date of this datasheet is printed at the lower right corner of this notification.

RESTRICTIONS ON PRODUCT USE

20070701-EN

• The information contained herein is subject to change without notice.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety

in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such

TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer,

personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These

TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high

quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury

(“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical

instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall

be made at the customer’s own risk.

• The products described in this document shall not be used or embedded to any downstream products of which

manufacture, use and/or sale are prohibited under any applicable laws and regulations.

• The information contained herein is presented only as a guide for the applications of our products. No responsibility

is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its

use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third

parties.

• Please contact your sales representative for product-by-product details in this document regarding RoHS

compatibility. Please use these products in this document in compliance with all applicable laws and regulations that

regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring

as a result of noncompliance with applicable laws and regulations.

• For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter

entitled Quality and Reliability Assurance/Handling Precautions.