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AD9645BCPZRL7-125 Datasheet(PDF) 10 Page - Analog Devices |
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AD9645BCPZRL7-125 Datasheet(HTML) 10 Page - Analog Devices |
10 / 36 page AD9645 Data Sheet Rev. 0 | Page 10 of 36 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD to AGND −0.3 V to +2.0 V DRVDD to AGND −0.3 V to +2.0 V Digital Outputs to AGND (D0x±, D1x±, DCO+, DCO−, FCO+, FCO−) −0.3 V to +2.0 V CLK+, CLK− to AGND −0.3 V to +2.0 V VINx+, VINx− to AGND −0.3 V to +2.0 V SCLK/DFS, SDIO/PDWN, CSB to AGND −0.3 V to +2.0 V RBIAS to AGND −0.3 V to +2.0 V VREF to AGND −0.3 V to +2.0 V VCM to AGND −0.3 V to +2.0 V Environmental Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The exposed paddle is the only ground connection on the chip. The exposed paddle must be soldered to the AGND plane of the user’s circuit board. Soldering the exposed paddle to the user’s board also increases the reliability of the solder joints and maximizes the thermal capability of the package. Table 7. Thermal Resistance Package Type Airflow Velocity (m/sec) θJA1,2 θJC1,3 θJB1,4 Ψ JT 1, 2 Unit 32-Lead LFCSP, 5 mm × 5 mm 0 37.1 3.1 20.7 0.3 °C/W 1.0 32.4 0.5 °C/W 2.5 29.1 0.8 °C/W 1 Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-STD 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). Typical θJA is specified for a 4-layer PCB with a solid ground plane. As shown in Table 7, airflow improves heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. ESD CAUTION |
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