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AD9645BCPZRL7-125 Datasheet(PDF) 10 Page - Analog Devices

Part # AD9645BCPZRL7-125
Description  Dual, 14-Bit, 80 MSPS/125 MSPS, Serial LVDS
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD9645BCPZRL7-125 Datasheet(HTML) 10 Page - Analog Devices

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AD9645
Data Sheet
Rev. 0 | Page 10 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +2.0 V
Digital Outputs to AGND
(D0x±, D1x±, DCO+, DCO−,
FCO+, FCO−)
−0.3 V to +2.0 V
CLK+, CLK− to AGND
−0.3 V to +2.0 V
VINx+, VINx− to AGND
−0.3 V to +2.0 V
SCLK/DFS, SDIO/PDWN, CSB to AGND
−0.3 V to +2.0 V
RBIAS to AGND
−0.3 V to +2.0 V
VREF to AGND
−0.3 V to +2.0 V
VCM to AGND
−0.3 V to +2.0 V
Environmental
Operating Temperature Range (Ambient)
−40°C to +85°C
Maximum Junction Temperature
150°C
Lead Temperature (Soldering, 10 sec)
300°C
Storage Temperature Range (Ambient)
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle is the only ground connection on the chip.
The exposed paddle must be soldered to the AGND plane of the
user’s circuit board. Soldering the exposed paddle to the user’s
board also increases the reliability of the solder joints and
maximizes the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
θJA1,2
θJC1,3
θJB1,4
Ψ
JT
1, 2
Unit
32-Lead LFCSP,
5 mm × 5 mm
0
37.1
3.1
20.7
0.3
°C/W
1.0
32.4
0.5
°C/W
2.5
29.1
0.8
°C/W
1 Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-STD 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces the θJA.
ESD CAUTION


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