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XPEBWT-H1-0000-00BE7 Datasheet(PDF) 1 Page - Cree, Inc |
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XPEBWT-H1-0000-00BE7 Datasheet(HTML) 1 Page - Cree, Inc |
1 / 12 page Product family data sheet Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. cree ® Xlamp® XP-e2 leds Product descriPtion The XLamp XP-e2 LeD builds on the unprecedented performance of the original XP-e by increasing lumen output up to 20% while providing a single die LeD point source for precise optical control. The XP- e2 LeD shares the same footprint as the original XP-e, providing a seamless upgrade path to more lumens and/or greater efficiency while shortening the design cycle for existing XP customers. XLamp XP-e2 LeDs are the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LED retrofit lamps, outdoor lighting, portable lighting, or indoor directional lighting. features • Available in white, outdoor white, 80-CRI, 85-CRI and 90-CRI white • ANSI-compatible chromaticity bins • Binned @ 85 °C • Maximum drive current: 1 A • Low thermal resistance: 9 °C/W • Wide viewing angle: 110° • Unlimited floor life at ≤ 30 °C/85% RH • Reflow solderable - JEDEC J-STD- 020C compatible • Electrically neutral thermal path Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 table of contents Flux Characteristics.................... 2 Characteristics .......................... 3 Relative Spectral Power Distribution............................... 3 Relative Flux vs. Junction Temperature ............................. 4 electrical Characteristics............. 4 Thermal Design......................... 5 Relative Flux vs. Current ............ 5 Relative Chromaticity vs. Current and Temperature - Warm White... 6 Typical Spatial Distribution.......... 7 Reflow Soldering Characteristics .. 8 Notes....................................... 9 Mechanical Dimensions..............10 Tape and Reel ..........................11 Packaging................................12 |
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