NCV8870

http://onsemi.com

3

Rating

Value

Unit

Dc Supply Voltage (VIN)

−0.3 to 40

V

Peak Transient Voltage (Load Dump on VIN)

45

V

Dc Supply Voltage (VDRV, GDRV)

12

V

Peak Transient Voltage (VFB)

−0.3 to 6

V

Dc Voltage (VC, VFB, ISNS)

−0.3 to 3.6

V

Dc Voltage (EN/SYNC)

−0.3 to 6

V

Dc Voltage Stress (VIN − VDRV)*

−0.7 to 40

V

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−65 to 150

°C

Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C

265 peak

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*An external diode from the input to the VIN pin is required if bootstrapping VDRV and VIN off of the output voltage.

PACKAGE CAPABILITIES

Characteristic

Value

Unit

ESD Capability (All Pins)

Human Body Model

Machine Model

w2.0

w200

kV

V

Moisture Sensitivity Level

1

−

Package Thermal Resistance

100

°C/W

Device Variations

The NCV8870 features several variants to better fit a

multitude of applications. The table below shows the typical

values of parameters for the parts that are currently

available.

TYPICAL VALUES

Part No.

SCE

NCV887000

93%

50 kHz

26 ms

15 mV/ms

400 mV

800 mA

600 mA

10.5 V

Y

NCV887001

93%

100 kHz

13 ms

33 mV/ms

400 mV

800 mA

600 mA

10.5 V

Y

DEFINITIONS

Symbol

Characteristic

Symbol

Characteristic

Symbol

Characteristic

Maximum Duty Cycle

Switching Frequency

Soft−Start Time

Slope Compensating Ramp

Current Limit Trip Voltage

Gate Drive Sourcing Current

Gate Drive Sinking Current

Drive Voltage

SCE

Short Circuit Enable