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MMSZ5252BT1G Datasheet(PDF) 1 Page - ON Semiconductor |
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MMSZ5252BT1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 7 page © Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 11 1 Publication Order Number: MMSZ5221BT1/D MMSZ52xxxT1G Series, SZMMSZ52xxxT1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. Features • 500 mW Rating on FR−4 or FR−5 Board • Wide Zener Reverse Voltage Range − 2.4 V to 110 V • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • General Purpose, Medium Current • ESD Rating of Class 3 (> 16 kV) per Human Body Model • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These are Pb−Free Devices* Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Symbol Max Units Total Power Dissipation on FR−5 Board, (Note 1) @ TL = 75°C Derated above 75°C PD 500 6.7 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 340 °C/W Thermal Resistance, Junction−to−Lead (Note 2) RqJL 150 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint. 2. Thermal Resistance measurement obtained via infrared Scan Method. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping† ORDERING INFORMATION SOD−123 CASE 425 STYLE 1 1 Cathode 2 Anode MARKING DIAGRAM See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. DEVICE MARKING INFORMATION †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MMSZ52xxBT1G, SZMMSZ52xxBT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSZ52xxBT3G, SZMMSZ52xxBT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel http://onsemi.com xx = Device Code (Refer to page 3) M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) xx MG G 1 MMSZ52xxCT1G, SZMMSZ52xxCT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSZ52xxCT3G, SZMMSZ52xxCT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel |
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