SN74ACT08EP

QUADRUPLE 2INPUT POSITIVEAND GATE

SCAS779 − SEPTEMBER 2004

2

POST OFFICE BOX 655303

−0.5 V to 7 V

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±20 mA

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±20 mA

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±50 mA

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±200 mA

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Package thermal impedance,

86

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

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† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 3)

MIN

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

−24

mA

IOL

Low-level output current

24

mA

∆t/∆v

Input transition rise or fall rate

8

ns/V

TA

Operating free-air temperature

−40

85

°C

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.