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UCC5341 Datasheet(PDF) 2 Page - Texas Instruments |
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UCC5341 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 5 page 2 UCC5341 ELECTRICAL CHARACTERISTICS: Unless otherwise specified, TA = 0°C to 70°C, AVDD = 3.0V to 5.5V, CAVDD = 100nF, CDVDD = 100nF, CCAT = 4.7 µF + 100nF, CRXX = 40pF, CDET < 56pF. All currents are positive into a specified pin. TA =TJ PARAMETER TEST CONDITION MI N TYP MAX UNITS Supply Current Section IDD No Output Load, SLEEP ≤ 0.5V 250 350 µA IDD SLEEP ≥ AVDD – 0.5V 0.5 3 µA RDVDD AVDD to DVDD 1.0 2 3.0 k Ω RCAT AVDD to CAT 10 20 32 Ω Receiver Section Input Refered Noise (Note 1) 10 pA Hz Detection Threshold 1.6 µs Input Pulse, 1µs ≤ RXX ≤ 8µs 200 400 nA Signal to Noise Ratio IDET = 200nA, (Note 1) 11.8 nA Lower Band Limit (Note 1) 50 kHz Upper Band Limit (Note 1) 1 MHz Output Pulse Width IDET = 400nApk to 20mApk, 0 to 200 µADC, 1.6 µs Input Pulse 1.0 8.0 µs RXX Output (VOL)IRXX = 800 µA 200 400 mV RXX Output (VOH)IRXX = –100 µA, DVDD –RXX 200 400 mV RXX Rise Time From 10% to 90% of DVDD 150 200 ns RXX Fall Time From 90% to 10% of DVDD 100 150 ns ABSOLUTE MAXIMUM RATINGS AVDD, CAT, DVDD ......................... –0.3V to 7V CAT, DET, DVDD, SLEEP, .......... –0.3V to AVDD + 0.3V IRXX ................................. –10mA to 10 mA IDET ......................................... 250mA Storage Temperature ................... –65°C to +150°C Junction Temperature ................... –55°C to +150°C Lead Temperature (Soldering, 10sec.) ............. +300°C All voltages are with respect to respect to AGND. DGND must be connected to AGND. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Da- tabook for thermal limitations and considerations of packages. SOIC-8, DIL-8 (Top View) D, N Package Note 1: Guaranteed by design. Not 100% tested in production. PIN DESCRIPTIONS AGND: Ground reference for analog circuits. Connect to circuit board ground plane. AVDD: Supply pin for analog circuits. Bypass to AGND with a 100nF or 1 µF ceramic capacitor. CAT: Filtered Supply for PIN diode cathode. Internally connected to AVDD through a 20 Ω resistor. Bypass to AGND with a 4.7 µF capacitor plus a 100nF ceramic ca- pacitor. DET: Input to receiver amplifier. Connect to PIN diode anode. Shield with AVDD and/or AGND from all other sig- nals, especially RXX. DGND: Ground pin for digital circuits. Connect to circuit board ground plane. DVDD: Supply pin for digital circuits. Internally connected to AVDD through a 2k Ω resistor. Bypass to DGND with a 100nF or 1 µF ceramic capacitor. RXX: Output of the detect amplifier and buffer. Connect to UART. Avoid coupling the RXX signed to DET. SLEEP: Sleep mode select pin. A logic high on SLEEP puts the chip into sleep mode, reducing IDD to 0.5 µA typical. ABSOLUTE MAXIMUM RATINGS |
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