2

UCC5341

PARAMETER

TEST CONDITION

MI N

TYP

MAX

UNITS

Supply Current Section

No Output Load, SLEEP

≤ 0.5V

250

350

µA

SLEEP

≥ AVDD – 0.5V

0.5

3

µA

AVDD to DVDD

1.0

2

3.0

k

Ω

AVDD to CAT

10

20

32

Ω

Receiver Section

Input Refered Noise

(Note 1)

10

pA

Hz

Detection Threshold

1.6

200

400

nA

Signal to Noise Ratio

11.8

nA

Lower Band Limit

(Note 1)

50

kHz

Upper Band Limit

(Note 1)

1

MHz

Output Pulse Width

µADC, 1.6

1.0

8.0

µs

µA

200

400

mV

200

400

mV

RXX Rise Time

From 10% to 90% of DVDD

150

200

ns

RXX Fall Time

From 90% to 10% of DVDD

100

150

ns

ABSOLUTE MAXIMUM RATINGS

AVDD, CAT, DVDD ......................... –0.3V to 7V

CAT, DET, DVDD, SLEEP, .......... –0.3V to AVDD + 0.3V

Storage Temperature ................... –65°C to +150°C

Junction Temperature ................... –55°C to +150°C

Lead Temperature (Soldering, 10sec.) ............. +300°C

All voltages are with respect to respect to AGND. DGND must

be connected to AGND. Currents are positive into, negative out

of the specified terminal. Consult Packaging Section of the Da-

tabook for thermal limitations and considerations of packages.

SOIC-8, DIL-8 (Top View)

D, N Package

Note 1: Guaranteed by design. Not 100% tested in production.

PIN DESCRIPTIONS

AGND: Ground reference for analog circuits. Connect to

circuit board ground plane.

AVDD: Supply pin for analog circuits. Bypass to AGND

with a 100nF or 1

µF ceramic capacitor.

CAT: Filtered Supply for PIN diode cathode. Internally

connected to AVDD through a 20

Ω resistor. Bypass to

AGND with a 4.7

µF capacitor plus a 100nF ceramic ca-

pacitor.

DET: Input to receiver amplifier. Connect to PIN diode

anode. Shield with AVDD and/or AGND from all other sig-

nals, especially RXX.

DGND: Ground pin for digital circuits. Connect to circuit

board ground plane.

DVDD: Supply pin for digital circuits. Internally connected

to AVDD through a 2k

Ω resistor. Bypass to DGND with a

100nF or 1

µF ceramic capacitor.

RXX: Output of the detect amplifier and buffer. Connect

to UART. Avoid coupling the RXX signed to DET.

SLEEP: Sleep mode select pin. A logic high on SLEEP

puts the chip into sleep mode, reducing IDD to 0.5

µA

typical.

ABSOLUTE MAXIMUM RATINGS