TM497FBK32R, TM497FBK32G 4194304 BY 32-BIT

TM893GBK32R, TM893GBK32G 8388608 BY 32-BIT

EXTENDED DATA OUT DYNAMIC RAM MODULES

SMMS672 – FEBRUARY 1997

4

POST OFFICE BOX 1443

Table 1. TM497FBK32R/G Connection Table

DATA BLOCK

RASx

CASx

DQ0 – DQ7

RAS0

CAS0

DQ8 – DQ15

RAS0

CAS1

DQ16 – DQ23

RAS2

CAS2

DQ24 – DQ31

RAS2

CAS3

Table 2. TM893GBK32R/G Connection Table

DATA BLOCK

RASx

CASx

DATA BLOCK

Side 1

Side 2

CASx

DQ0 – DQ7

RAS0

RAS1

CAS0

DQ8 – DQ15

RAS0

RAS1

CAS1

DQ16 – DQ23

RAS2

RAS3

CAS2

DQ24 – DQ31

RAS2

RAS3

CAS3

single-in-line memory module and components

PC substrate: 1,27

± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for TM497FBK32G and TM893GBK32G: Nickel plate and gold plate over copper

Contact area for TM497FBK32R and TM893GBK32R: Nickel plate and tin-lead over copper