Packaging Technology

10

Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide

Notes:

1.

All dimensions are in millimeters.

2.

All dimensions and tolerances conform to ANSI Y14.5M-1994.

Figure 2-2.

MCH Package Dimensions (Side View)

Figure 2-3.

MCH Package Dimensions (Bottom View)

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave

(bowl shaped) orientation after reflow

0.20

–C–

Die

Substrate

0.435 ± 0.025 mm

See note 3

Seating Plane

1.92 ± 0.078 mm

See note 1.

Decoup

Cap

0.7 mm Max

2.355 ± 0.082 mm

0.84 ± 0.05 mm

0.20 See note 4.