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TPIC5404DW Datasheet(PDF) 3 Page - Texas Instruments |
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TPIC5404DW Datasheet(HTML) 3 Page - Texas Instruments |
3 / 15 page TPIC5404 HBRIDGE POWER DMOS ARRAY SLIS023B − MARCH 1994 − REVISED SEPTEMBER 1995 2−3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 electrical characteristics, TC = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V(BR)DSX Drain-to-source breakdown voltage ID = 250 µA, VGS = 0 60 V VGS(th) Gate-to-source threshold voltage ID = 1 mA, VDS = VGS 1.5 1.85 2.2 V V(BR) Reverse drain-to-GND breakdown voltage (across D1, D2) Drain-to-GND current = 250 µA 100 V VDS(on) Drain-to-source on-state voltage ID = 2 A, See Notes 2 and 3 VGS = 10 V, 0.6 0.7 V VF Forward on-state voltage, GND-to-drain ID = 2 A (D1, D2), See Notes 2 and 3 7.5 V VF(SD) Forward on-state voltage, source-to-drain IS = 2 A, VGS = 0 (Z1, Z2, Z3, Z4), See Notes 2 and 3 1 1.2 V IDSS Zero-gate-voltage drain current VDS = 48 V, TC = 25°C 0.05 1 A IDSS Zero-gate-voltage drain current VDS = 48 V, VGS = 0 TC = 125°C 0.5 10 µA IGSSF Forward gate current, drain short circuited to source VGS = 16 V, VDS = 0 10 100 nA IGSSR Reverse gate current, drain short circuited to source VSG = 16 V, VDS = 0 10 100 nA Ilkg Leakage current, drain-to-GND VR = 48 V TC = 25°C 0.05 1 A Ilkg Leakage current, drain-to-GND VR = 48 V TC = 125°C 0.5 10 µA rDS(on) Static drain-to-source on-state resistance VGS = 10 V, ID = 2 A, TC = 25°C 0.3 0.35 Ω rDS(on) Static drain-to-source on-state resistance ID = 2 A, See Notes 2 and 3 and Figures 6 and 7 TC = 125°C 0.41 0.5 Ω gfs Forward transconductance VDS = 15 V, See Notes 2 and 3 ID = 1 A, 1.6 1.9 S Ciss Short-circuit input capacitance, common source 220 275 Coss Short-circuit output capacitance, common source VDS = 25 V, f = 1 MHz VGS = 0, 120 150 pF Crss Short-circuit reverse-transfer capacitance, common source VDS = 25 V, f = 1 MHz VGS = 0, 100 125 pF NOTES: 2. Technique should limit TJ − TC to 10°C maximum, pulse duration ≤ 5 ms. 3. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts. source-to-drain diode characteristics, TC = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT trr(SD) Reverse-recovery time IS = 1 A, VGS = 0, di/dt = 100 A/ µs, VDS = 48 V, (Z1 and Z3), 120 ns QRR Total diode charge SGS di/dt = 100 A/ µs, See Figure 1 DS (Z1 and Z3), 0.12 µC trr(SD) Reverse-recovery time IS = 1 A, VGS = 0, di/dt = 100 A/ µs, VDS = 48 V, (Z2 and Z4), 280 ns QRR Total diode charge SGS di/dt = 100 A/ µs, See Figure 1 DS (Z2 and Z4), 0.9 µC GND-to-drain diode characteristics, TC = 25°C (see schematic, D1 and D2) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT trr Reverse-recovery time IF = 1 A, VDS = 48 V, 260 ns QRR Total diode charge IF = 1 A, di/dt = 100 A/ µs, VDS = 48 V, See Figure 1 2.2 µC |
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