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TM8TT64KPN Datasheet(PDF) 8 Page - Texas Instruments

Part # TM8TT64KPN
Description  SYNCHRONOUS DYNAMIC RAM MODULES
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TM8TT64KPN Datasheet(HTML) 8 Page - Texas Instruments

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TM4TT64KPN 4194304 BY 64BIT
TM8TT64KPN 8388608 BY 64BIT
SYNCHRONOUS DYNAMIC RAM MODULES
SMMS699A − MARCH 1998 − REVISED AUGUST 1998
8
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
ac timing requirements†‡
’xTT64KPN-8
’xTT64KPN-8A
UNIT
MIN
MAX
MIN
MAX
UNIT
tCK2
Cycle time, CK
CAS latency = 2
10
15
ns
tCK3
Cycle time, CK
CAS latency = 3
8
8
ns
tCH
Pulse duration, CK high
3
3
ns
tCL
Pulse duraction, CK low
3
3
ns
tAC2
Access time, CK high to data out
(see Note 11)
CAS latency = 2
6
7.5
ns
tAC3
Access time, CK high to data out
(see Note 11)
CAS latency = 3
6
6
ns
tOH
Hold time, CK high to data out
3
3
ns
tLZ
Delay time, CK high to DQ in low-impedance state
(see Note 12)
1
1
ns
tHZ
Delay time, CK high to DQ in high-impedance state
(see Note 13)
8
8
ns
tIS
Setup time, address, control, and data input
2
2
ns
tIH
Hold time, address, control, and data input
1
1
ns
tIH
Hold time, address, control, and data input
1
1
ns
tCESP Power down/self-refresh exit time
10
10
ns
tRAS
Delay time, ACTV command to DEAC or DCAB command
48
100 000
48
100 000
ns
tRC
Delay time, ACTV, MRS, REFR, or SLFR to ACTV, MRS, REFR, or SLFR command
68
68
ns
tRCD
Delay time ACTV command to READ, READ-P, WRT, or WRT-P command
(see Note 14)
20
20
ns
tRP
Delay time, DEAC or DCAB command to ACTV, MRS, REFR, or SLFR command
20
20
ns
tRRD
Delay time, ACTV command in one bank to ACTV command in the other bank
16
16
ns
tRSA
Delay time, MRS command to ACTV, MRS, REFR, or SLFR command
16
16
ns
tAPR
Final data out of READ-P operation to ACTV, MRS, SLFR, or REFR command
tRP −(CL−1)*tCK
ns
tAPW
Final data in of WRT-P operation to ACTV, MRS, SLFR, or REFR command
tRP + 1 tCK
ns
tT
Transition time
1
5
1
5
ms
† All references are made to the rising transition of CK unless otherwise noted.
‡ Specifications in this table represent a single SDRAM device.
NOTES: 11. tAC is referenced from the rising transition of CK that precedes the data-out cycle. For example, the first data out tAC is referenced
from the rising transition of ck that is read latency (one cycle after the READ command). Access time is measured at output reference
level 1.4 V.
12. tLZ is measured from the rising transition of ck that is read latency (one cycle after the READ command).
13. tHZ (max) defines the time at which the outputs are no longer driven and is not referenced to output voltage levels.
14. For read or write operations with automatic deactivate, tRCD must be set to satisfy minimum tRAS.


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