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TPS61165TDBVRQ1 Datasheet(PDF) 2 Page - Texas Instruments

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Part # TPS61165TDBVRQ1
Description  High Brightness White LED Driver in SOT-23 Package
Download  24 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS61165TDBVRQ1 Datasheet(HTML) 2 Page - Texas Instruments

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TPS61165-Q1
SLVSB73
– DECEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
TA
OPEN LED PROTECTION
PACKAGE
PACKAGE MARKING
–40°C to 105°C
38 V (typical)
TPS61165TDBVRQ1
SBM
(1)
For the most current package and ordering information, see the TI Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Supply Voltages on VIN (2)
–0.3 to 20
V
Voltages on CTRL(2)
–0.3 to 20
V
VI
Voltage on FB and COMP(2)
–0.3 to 3
V
Voltage on SW(2)
–0.3 to 40
V
PD
Continuous Power Dissipation
See the Thermal Information Table
TJ
Operating Junction Temperature Range
–40 to 150
°C
TSTG
Storage Temperature Range
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
TPS61165-Q1
THERMAL METRIC(1)(2)
UNITS
DBV
θJA
Junction-to-ambient thermal resistance
210.1
θJC(top)
Junction-to-case(top) thermal resistance
46.8
θJB
Junction-to-board thermal resistance
56.7
°C/W
ψJT
Junction-to-top characterization parameter
0.5
ψJB
Junction-to-board characterization parameter
50.2
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
UNIT
VI
Input voltage range, VIN
3
18
V
VO
Output voltage range
VIN
38
V
L
Inductor(1)
10
22
μH
fdim
PWM dimming frequency
5
100
kHz
CIN
Input capacitor
1
μF
CO
Output capacitor
1
10
μF
TA
Operating ambient temperature
–40
105
°C
TJ
Operating junction temperature
–40
125
°C
ESD rating, CDM
1.0
kV
ESD rating, HBM
1.0
kV
ESD rating, MM
100
V
(1)
These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in
other applications but should be fully tested by the user.
2
Submit Documentation Feedback
Copyright
© 2011, Texas Instruments Incorporated
Product Folder Link(s): TPS61165-Q1


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