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DISSIPATION RATINGS

(1) (2)

RELATED DC/DC PRODUCTS

TPS54611-EP, TPS54612-EP

TPS54613-EP, TPS54614-EP

TPS54615-EP, TPS54616-EP

SGLS293A – FEBRUARY 2005 – REVISED AUGUST 2005

PACKAGE

THERMAL IMPEDANCE

JUNCTION-TO-AMBIENT

POWER RATING

POWER RATING

POWER RATING

28-pin PWP with solder

18.2

°C/W

3.02 W

2.2 W

28-pin PWP without solder

40.5

°C/W

2.48 W

1.36 W

0.99 W

(1)

For more information on the PWP package, see the Texas Instruments technical brief SLMA002.

(2)

Test board conditions:

a. 3 inch x 3 inch, 4 layers, thickness: 0.062 inch

b. 1.5 oz. copper traces located on the top of the PCB

c. 1.5 oz. copper ground plane on the bottom of the PCB

d. 0.5 oz. copper ground planes on the 2 internal layers

e. 12 thermal vias (see the Recommended Land Pattern section in the applications section of this data sheet)

(3)

Maximum power dissipation may be limited by overcurrent protection.

ADDITIONAL 6A SWIFT™ DEVICES

DEVICE

OUTPUT VOLTAGE

TPS54610

0.9 V to 3.3 V

TPS54672

DDR memory adjustable

TPS54680

Sequencing adjustable

TPS54673

Prebias adjustable

•

TPS40000—Low-input, voltage-mode synchronous buck controller

•

TPS759xx—7.5-A low dropout regulator

•

PT6440 series—6-A plugin modules

4