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SST32HF802-90-4E-EK Datasheet(PDF) 2 Page - Silicon Storage Technology, Inc

Part # SST32HF802-90-4E-EK
Description  Multi-Purpose Flash (MPF) SRAM ComboMemory
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Manufacturer  SST [Silicon Storage Technology, Inc]
Direct Link  http://www.sst.com/
Logo SST - Silicon Storage Technology, Inc

SST32HF802-90-4E-EK Datasheet(HTML) 2 Page - Silicon Storage Technology, Inc

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Data Sheet
Multi-Purpose Flash (MPF) + SRAM ComboMemory
SST32HF802 / SST32HF162 / SST32HF164
©2001 Silicon Storage Technology, Inc.
S71171-05-000
8/01
520
technologies. The total energy consumed is a function of
the applied voltage, current, and time of application. Since
for any given voltage range, the SuperFlash technology
uses less current to program and has a shorter erase time,
the total energy consumed during any Erase or Program
operation is less than alternative flash technologies.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
Device Operation
The ComboMemory uses BES# and BEF# to control oper-
ation of either the SRAM or the flash memory bank. When
BES# is low, the SRAM Bank is activated for Read and
Write operation. When BEF# is low the flash bank is acti-
vated for Read, Program or Erase operation. BES# and
BEF# cannot be at low level at the same time. If BES# and
BEF# are both asserted to low level bus contention will
result and the device may suffer permanent damage. All
address, data, and control lines are shared by SRAM Bank
and flash bank which minimizes power consumption and
loading. The device goes into standby when both bank
enables are high.
SRAM Operation
With BES# low and BEF# high, the SST32HF802/162
operate as 128K x16 CMOS SRAM, and the SST32HF164
operates as 256K x16 CMOS SRAM, with fully static oper-
ation requiring no external clocks or timing strobes. The
SST32HF802/162 SRAM is mapped into the first 128
KWord address space of the device, and the SST32HF164
SRAM is mapped into the first 256 KWord address space.
When BES# and BEF# are high, both memory banks are
deselected and the device enters standby mode. Read and
Write cycle times are equal. The control signals UBS# and
LBS# provide access to the upper data byte and lower data
byte. See Table 3 for SRAM read and write data byte con-
trol modes of operation.
SRAM Read
The SRAM Read operation of the SST32HF802/162/164 is
controlled by OE# and BES#, both have to be low with
WE# high for the system to obtain data from the outputs.
BES# is used for SRAM bank selection. OE# is the output
control and is used to gate data from the output pins. The
data bus is in high impedance state when OE# is high. See
Figure 3 for the Read cycle timing diagram.
SRAM Write
The SRAM Write operation of the SST32HF802/162/164
is controlled by WE# and BES# being low for the system
to write to the SRAM. During the Word-Write operation,
the addresses and data are referenced to the rising edge
of WE# or BES#, which ever occurs first. The write time is
measured from the last falling edge to the rising edge of
WE# or BES#. Refer to the Write cycle timing diagrams,
Figures 4 and 5, for further details.
Flash Operation
With BEF# active, the SST32HF162/164 operate as 1M
x16 flash memory and the SST32HF802 operates as 512K
x16 flash memory. The flash memory bank is read using
the common address lines, data lines, WE# and OE#.
Erase and Program operations are initiated with the
JEDEC standard SDP command sequences. Address and
data are latched during the SDP commands and during the
internally timed Erase and Program operations.
Flash Read
The Read operation of the SST32HF802/162/164 devices
is controlled by BEF# and OE#. Both have to be low, with
WE# high, for the system to obtain data from the outputs.
BEF# is used for flash memory bank selection. When
BEF# and BES# are high, both banks are deselected and
only standby power is consumed. OE# is the output con-
trol and is used to gate data from the output pins. The data
bus is in high impedance state when OE# is high. Refer to
Figure 6 for further details.
Flash Erase/Program Operation
SDP commands are used to initiate the flash memory bank
Program and Erase operations of the SST32HF802/162/
164. SDP commands are loaded to the flash memory bank
using standard microprocessor write sequences. A com-
mand is loaded by asserting WE# low while keeping BEF#
low and OE# high. The address is latched on the falling
edge of WE# or BEF#, whichever occurs last. The data is
latched on the rising edge of WE# or BEF#, whichever
occurs first.
Flash Word-Program Operation
The flash memory bank of the SST32HF802/162/164
devices is programmed on a word-by-word basis. Before
the Program operations, the memory must be erased first.
The Program operation consists of three steps. The first
step is the three-byte load sequence for Software Data Pro-
tection. The second step is to load word address and word
data. During the Word-Program operation, the addresses


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