5962R9675502V9A datasheet(7/9 Pages) INTERSIL

Part #	5962R9675502V9A

Description	Radiation Hardened High Speed, Monolithic Digital-to-Analog Converter

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Manufacturer	INTERSIL [Intersil Corporation]

Direct Link	http://www.intersil.com/cda/home

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7 / 9 page

HS-565BRH, HS-565BEH

7

FN4607.4

May 7, 2012

Die Characteristics

DIE DIMENSIONS:

179 mils x 107 mils x 19 mils

INTERFACE MATERIALS:

Glassivation:

Type: AlCu

Thickness: 8k

Å ±1kÅ

Top Metallization:

Type: Al/Copper

Thickness: 16k

Å ±2kÅ

Substrate:

Bipolar DI,

Backside Finish:

Silicon

ASSEMBLY RELATED INFORMATION

Substrate Potential:

Tie Substrate to VREF GND

ADDITIONAL INFORMATION:

Worst Case Current Density:

2.0 x 105 A/cm2

Transistor Count:

200

Metallization Mask Layout

HS-565BRH, HS-565BEH

VCC

(MSB)

BIT 1

BIT 2

BIT 3

BIT 4

BIT 5

BIT 6

BIT 7

BIT 8

BIT 9

BIT 10

BIT 11

BIT 12

(LSB)

POWER

GND

20V

SPAN

10V

SPAN

IDAC

OUT

BIPOLAR

12

-VS

VREF IN

VREF

GND

VREF OUT

3

NC

3

NC

1

A

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5962R9675502V9A Datasheet(PDF) 7 Page - Intersil Corporation

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