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HS-565BEH Datasheet(PDF) 7 Page - Intersil Corporation |
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HS-565BEH Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 9 page HS-565BRH, HS-565BEH 7 FN4607.4 May 7, 2012 Die Characteristics DIE DIMENSIONS: 179 mils x 107 mils x 19 mils INTERFACE MATERIALS: Glassivation: Type: AlCu Thickness: 8k Å ±1kÅ Top Metallization: Type: Al/Copper Thickness: 16k Å ±2kÅ Substrate: Bipolar DI, Backside Finish: Silicon ASSEMBLY RELATED INFORMATION Substrate Potential: Tie Substrate to VREF GND ADDITIONAL INFORMATION: Worst Case Current Density: 2.0 x 105 A/cm2 Transistor Count: 200 Metallization Mask Layout HS-565BRH, HS-565BEH VCC (MSB) BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 8 BIT 9 BIT 10 BIT 11 BIT 12 (LSB) POWER GND 20V SPAN 10V SPAN IDAC OUT BIPOLAR 12 -VS VREF IN VREF GND VREF OUT 3 NC 3 NC 1 A |
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