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5962F9563201QEC Datasheet(PDF) 3 Page - Intersil Corporation |
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5962F9563201QEC Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 4 page HS-26CT31RH, HS-26CT31EH 3 FN2929.4 February 23, 2012 Die Characteristics DIE DIMENSIONS: 96.5 milx195 milsx21 mils (2450x4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 10k Å ± 1kÅ Metallization: M1: Mo/TiW Thickness: 5800 Å M2: Al/Si/Cu (Top) Thickness: 10k Å ±1kÅ Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VDD ADDITIONAL INFORMATION: Worst Case Current Density: <2.0x105A/cm2 Bond Pad Size: 110µmx100µm |
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