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TPS7A3301RGWR Datasheet(PDF) 2 Page - Texas Instruments |
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TPS7A3301RGWR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page TPS7A33 SBVS169B – DECEMBER 2011 – REVISED MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT VOUT TPS7A33xxyyyz XX is nominal output voltage (01 = Adjustable).(2) YYY is package designator. Z is package quantity. (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com. (2) For fixed –1.2-V operation, tie FB to OUT. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range –40°C ≤ TJ ≤ +125°C, unless otherwise noted. VALUE MIN MAX UNIT IN pin to GND pin –36 +0.3 V OUT pin to GND pin –33 +0.3 V OUT pin to IN pin –0.3 +36 V FB pin to GND pin –2 +0.3 V Voltage FB pin to IN pin –0.3 +36 V EN pin to GND pin –36 +10 V NR/SS pin to IN pin –0.3 +36 V NR/SS pin to GND pin –2 +0.3 V Current Peak output Internally limited Operating virtual junction, TJ, absolute maximum range (2) –40 +150 °C Temperature Storage, Tstg –65 +150 °C Human body model (HBM) 1 kV Electrostatic discharge rating Charged device model (CDM) 500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute- maximum rated conditions for extended periods may affect device reliability. (2) No permanent damage will occur to the part operating within this range though electrical performance is not ensured outside the operating free-air temperature range. THERMAL INFORMATION TPS7A33 THERMAL METRIC(1) KC (TO-220) RGW (QFN)(2) UNITS 7 PINS 20 PINS θJA Junction-to-ambient thermal resistance 31.2 30.5 θJC(top) Junction-to-case(top) thermal resistance 40.0 27.6 θJB Junction-to-board thermal resistance 17.4 N/A °C/W ψJT Junction-to-top characterization parameter 6.4 0.37 ψJB Junction-to-board characterization parameter 17.2 10.6 θJC(bottom) Junction-to-case(bottom) thermal resistance 0.8 4.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The RGW package is product preview. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated |
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