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TMS465409 Datasheet(PDF) 6 Page - Texas Instruments |
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TMS465409 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 33 page TMS464409, TMS464409P, TMS465409, TMS465409P 16 777 216 BY 4-BIT EXTENDED DATA OUT DYNAMIC RANDOM-ACCESS MEMORIES SMKS895A – MAY 1997 – REVISED OCTOBER 1997 6 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 hidden refresh A hidden refresh can be performed while maintaining valid data at the output pin. This is accomplished by holding CAS at VIL after a read operation and cycling RAS after a specified precharge period, similar to a RAS-only refresh cycle. The external address is ignored, and the refresh address is generated internally. CAS-before-RAS ( CBR ) refresh CBR refresh is performed by bringing CAS low earlier than RAS (see parameter tCSR) and holding it low after RAS falls (see parameter tCHR). For successive CBR refresh cycles, CAS can remain low while cycling RAS. The external address is ignored, and the refresh address is generated internally. battery-backup refresh A low-power battery-backup refresh mode that requires less than 250 mA of refresh current is available on the TMS464409P and TMS465409P. Data integrity is maintained using CBR refresh with a period of 31.25 ms while holding RAS low for less than 300 ns. To minimize current consumption, all input levels must be at LVCMOS levels (VIL < 0.2 V, VIH >VCC – 0.2 V). self-refresh (TMS46x409P) The self-refresh mode is entered by dropping CAS low prior to RAS going low. Then CAS and RAS are both held low for a minimum of 100 ms. The chip is then refreshed internally by an on-board oscillator. No external address is required because the CBR counter is used to keep track of the address. To exit the self-refresh mode, both RAS and CAS are brought high to satisfy tCHS. Upon exiting self-refresh mode, a burst refresh (refreshes a full set of row addresses) must be executed before continuing with normal operation. The burst refresh ensures the DRAM is fully refreshed. power up To achieve proper device operation, an initial pause of 200 µs followed by a minimum of eight initialization cycles is required after power up to the full VCC level. These eight initialization cycles must include at least one refresh ( RAS-only or CBR ) cycle. test mode The test mode (see Figure 1) is initiated with a CBR-refresh cycle while simultaneously holding the W input low. The entry cycle performs an internal refresh cycle while internally setting the device to perform parallel read or write on subsequent cycles. While in the test mode, any data sequence can be performed. The device exits test mode if a CBR refresh cycle with W held high or a RAS-only refresh cycle is performed. In the test mode, the device is configured as 1024K bits × 4 bits for each DQ. Each DQ pin has a separate 4-bit parallel read and write data bus that ignores column addresses A0 and A1. During a read cycle, the four internal bits are compared for each DQ pin. If the four bits agree, DQ goes high; if not, DQ goes low. During a write cycle, the data states of all four DQs must be the same to ensure proper function of the test mode. Test time is reduced by a factor of four for this series. |
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