TQP7M9101

¼W High Linearity Amplifier

Mechanical Information

Package Information and Dimensions

This

package

is

lead-free/RoHS-

compliant. The plating material on the

leads is NiPdAu. It is compatible with

both lead-free (maximum 260 °C reflow

temperature) and lead (maximum 245 °C

reflow temperature) soldering processes.

The component will be marked with a

“7M9101”

designator

with

an

alphanumeric lot code on the top surface

of package.

7M9101

Mounting Configuration

All dimensions are in millimeters (inches). Angles are in degrees.

Notes:

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. RF trace width depends upon the PC board material and construction.

4. Use 1 oz. Copper minimum.

Advanced Data Sheet: Rev D 09/19/11

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9 of 9 -

Disclaimer: Subject to change without notice

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