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TPS65257RHAR Datasheet(PDF) 7 Page - Texas Instruments |
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TPS65257RHAR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 34 page TPS65257 www.ti.com SLVSB32 – SEPTEMBER 2011 TERMINAL FUNCTIONS (continued) NAME NO. I/O DESCRIPTION USB1 fault flag output, open drain, active low. Asserted when overcurrent USB_nFAULT 35 I or overtemperature condition is detected in the switch. LX3 36, 37 O Switching node for Buck3 VIN3 38 I Input supply for Buck3. Fit a 10- µF ceramic capacitor close to this pin. Bootstrap capacitor for Buck3. Fit a 47-nF ceramic capacitor from this pin BST3 39 I to the switching node. Enable pin for Buck3. A high signal on this pin enables the converter. For EN3 40 I a delayed start-up add a small ceramic capacitor from this pin to ground. PowerPAD. Connect to system ground for electrical and thermal PowerPAD connection. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted, all voltages are with respect to GND) Voltage range at VIN1,VIN2, VIN3, LX1, LX2, LX3 –0.3 to 18 V Voltage range at LX1, LX2, LX3 (maximum withstand voltage transient < 10 ns) –3 to 18 V Voltage at BST1, BST2, BST3 referenced to LX pin –0.3 to 7 V Voltage at V7V, COMP1, COMP2, COMP3, USB_Vin, USB_Vo –0.3 to 7 V Voltage at V3V, RLIM1, RLIM2, RLIM3, EN1,EN2, EN3, SS1, SS2, SS3, FB1, FB2,FB3 , –0.3 to 3.6 V PGOOD, ROSC, PB_IN INT, USB_EN, USB_ILIM Voltage at GND –0.3 to 0.3 V TJ Operating junction temperature range –40 to 125 °C TSTG Storage temperature range –55 to 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions " is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input operating voltage 4.5 16 V TA Junction temperature –40 85 °C ELECTROSTATIC DISCHARGE (ESD) PROTECTION MIN MAX UNIT Human body model (HBM), PB_IN pin to ground 10000 V Any other pin 2000 Charge device model (CDM) 500 V PACKAGE DISSIPATION RATINGS (1) TA = 25°C TA = 55°C TA = 85°C PACKAGE θJA (°C/W) POWER RATING (W) POWER RATING (W) POWER RATING (W) RHA 30 3.33 2.3 1.3 (1) Based on JEDEC 51.5 HIGH K environment measured on a 76.2 x 114 x 0.6-mm board with the following layer arrangement: (a) Top layer: 2 Oz Cu, 6.7% coverage (b) Layer 2: 1 Oz Cu, 90% coverage (c) Layer 3: 1 Oz Cu, 90% coverage (d) Bottom layer: 2 Oz Cu, 20% coverage Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TPS65257 |
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