Electronic Components Datasheet Search |
|
TPS62172DSGT Datasheet(PDF) 2 Page - Texas Instruments |
|
|
TPS62172DSGT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page TPS62170, TPS62171 TPS62172, TPS62173 SLVSAT8A – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) TA OUTPUT VOLTAGE PART NUMBER(2) PACKAGE ORDERING PACKAGE MARKING adjustable TPS62170 TPS62170DSG QUE 1.8 V TPS62171 TPS62171DSG QUF -40°C to 85°C 8-Pin WSON 3.3 V TPS62172 TPS62172DSG QUG 5.0 V TPS62173 TPS62173DSG QUH (1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet. (2) Contact the factory to check availability of other fixed output voltage versions. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VIN –0.3 to 20 V EN –0.3 to VIN+0.3 Pin Voltage Range(2) SW -0.3 to VIN+0.3 V FB, PG, VOS –0.3 to 7 V Power Good sink PG 10 mA current Operating junction temperature range, TJ –40 to 125 Temperature range °C Storage temperature range, Tstg –65 to 150 HBM Human body model 2 kV ESD rating(3) CDM Charge device model 0.5 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. (3) ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL INFORMATION TPS6217X THERMAL METRIC(1) UNITS DSG (8) PINS θJA Junction-to-ambient thermal resistance 61.8 θJC(TOP) Junction-to-case(top) thermal resistance 61.3 θJB Junction-to-board thermal resistance 15.5 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 15.4 θJC(BOTTOM) Junction-to-case(bottom) thermal resistance 8.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT Supply Voltage, VIN 3 17 V Operating free air temperature, TA –40 85 °C Operating junction temperature, TJ –40 125 °C 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TPS62170 TPS62171 TPS62172 TPS62173 |
Similar Part No. - TPS62172DSGT |
|
Similar Description - TPS62172DSGT |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |