MCR106 Series

2

Motorola Thyristor Device Data

Rating

Symbol

Value

Unit

Storage Temperature Range

Tstg

–40 to +150

°C

Mounting Torque(1)

—

6

in. lb.

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Case

R

θJC

3

°C/W

Thermal Resistance, Junction to Ambient

R

θJA

75

°C/W

Characteristic

Symbol

Min

Typ

Max

Unit

Peak Forward or Reverse Blocking Current

(VAK = Rated VDRM or VRRM)

TJ = 25°C

TJ = 110°C

IDRM, IRRM

—

—

—

—

10

200

µA

µA

Forward “On” Voltage

(ITM = 4 A Peak)

VTM

—

—

2

Volts

Gate Trigger Current (Continuous dc)(2)

(VAK = 7 Vdc, RL = 100 Ohms)

(VAK = 7 Vdc, RL = 100 Ohms, TC = –40°C)

IGT

—

—

—

—

200

500

µA

Gate Trigger Voltage (Continuous dc)

(VAK = 7 Vdc, RL = 100 Ohms, TC = 25°C)

VGT

—

—

1

Volts

Gate Non-Trigger Voltage

(VAK = Rated VDRM, RL = 100 Ohms, TJ = 110°C)

VGD

0.2

—

—

Volts

Holding Current

(VAK = 7 Vdc, TC = 25°C)

IH

—

—

5

mA

Forward Voltage Application Rate

(TJ = 110°C)

dv/dt

—

10

—

V/

µs

1. Torque rating applies with use of compression washer (B52200-F006 or equivalent). Mounting torque in excess of 6 in. lb. does not

appreciably lower case-to-sink thermal resistance. Anode lead and heatsink contact pad are common. (See AN209B).

For soldering purposes (either terminal connection or device mounting), soldering temperatures shall not exceed +200

°C. For optimum

results, an activated flux (oxide removing) is recommended.

2. RGK current is not included in measurement.