OPA2333-HT

SBOS483F – JULY 2009 – REVISED AUGUST 2012

www.ti.com

TA

PACKAGE

ORDERABLE PART NUMBER

TOP-SIDE MARKING

KGD

OPA2333SKGD1

NA

JD

OPA2333SJD

OPA2333SJD

–55°C to 210°C

HKJ

OPA2333SHKJ

OPA2333SHKJ

HKQ

OPA2333SHKQ

OPA2333SHKQ

–55°C to 175°C

D

OPA2333HD

O2333H

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

BARE DIE INFORMATION

BACKSIDE

BOND PAD

DIE THICKNESS

BACKSIDE FINISH

POTENTIAL

METALLIZATION COMPOSITION

15 mils.

Silicon with backgrind

V-

Al-Si-Cu (0.5%)

Table 2. BOND PAD COORDINATES

DESCRIPTION

PAD NUMBER

a

b

c

d

OUT A

1

21.20

1288.50

97.20

1364.50

–IN A

2

21.20

923.65

97.20

999.65

+IN A

3

21.20

533.05

97.20

609.05

V–

4

31.30

172.20

107.30

248.20

+IN B

5

864.80

162.25

940.80

238.25

–IN B

6

864.80

552.65

940.80

628.65

OUT B

7

864.80

897.10

940.80

973.10

V+

8

854.70

1280.45

930.70

1356.45

2

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