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MCP1754T-1802E-MC Datasheet(PDF) 8 Page - Microchip Technology |
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MCP1754T-1802E-MC Datasheet(HTML) 8 Page - Microchip Technology |
8 / 42 page MCP1754/MCP1754S DS22276A-page 8 © 2011 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA -40 +125 °C Operating Temperature Range TJ -40 +150 °C Storage Temperature Range TA -55 +150 °C Thermal Package Resistance Thermal Resistance, SOT-223-3 θ JA θ JC — — 62 15 — — °C/W Thermal Resistance, SOT-223-5 θ JA θ JC — — 62 15 — — °C/W Thermal Resistance, SOT-23A-3 θ JA θ JC — — 336 110 — — °C/W Thermal Resistance, SOT-89-3 θ JA θ JC — — 153.3 100 — — °C/W Thermal Resistance, 2X3 DFN θ JA θ JC — — 93 26 — — °C/W Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. |
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