0

25

50

75

100

125

150

175

200

225

250

0

50

100

150

200

T -CaseTemperature-°C

C

V

at3.6V

CC1,2

V

at5.5V

CC1,2

ISO7220A-Q1

ISO7221A-Q1

ISO7221C-Q1

www.ti.com

SLLS965C – JULY 2009 – REVISED MAY 2012

SOIC-8 PACKAGE THERMAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

212

Junction-to-air thermal resistance

°C/W

High-K thermal resistance

122

Junction-to-board thermal resistance

37

°C/W

Junction-to-case thermal resistance

69.1

°C/W

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

Figure 5. SOIC-8

DEVICE FUNCTION TABLE

INPUT IN

OUTPUT OUT

H

H

PU

PU

L

L

Open

H

PD

PU

X

H

(1)

PU = Powered up(Vcc

≥ 3.0 V), PD = Powered down (Vcc ≤ 2.5 V), X = Irrelevant, H = High level,

L = Low level

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