HD3SS0001

SLAS827 – FEBRUARY 2012

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PIN FUNCTIONS (continued)

PIN

I/O

DESCRIPTION

NUMBER

NAME

11

LSTx

I/O

Controller Side UART TX SignalController Side UART RX Signal

12

LSRx

10

S0

Control Lines for configuring device. S0 and 10G_EN incorporate integrated pulldowns and

DP_EN

13

I

DP_EN incorporates a pullup. Therefore, the default device state will be “Detect Mode” per the

Truth Table provided these lines are not driven.

10G_EN

14

1, 15, 24

VDD

Supply

Positive power supply voltage

4, 7, 18, 21,

GND

Supply

Negative power supply voltage

Center Pad

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

Supply voltage

–0.5

4

V

Differential I/O

–0.5

4

Voltage range

V

Control pin/buffers

–0.5

VDD+0.5

±1,500

Electrostatic

V

discharge

±500

Continuous power dissipation

See Thermal Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC/ESDA JS-001-2011

(4)

Tested in accordance with JEDEC JESD22 C101-E

THERMAL INFORMATION

HD3SS0001

UNITS

28-PIN TQFN (RLF)

Junction-to-ambient thermal resistance

37.9

Junction-to-case (top) thermal resistance

34.4

Junction-to-case (bottom) thermal resistance

1.4

°C/W

Junction-to-board thermal resistance

8.7

Junction-to-top characterization parameter

0.6

Junction-to-board characterization parameter

8.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

UNIT

Device power dissipation

4.6

7.6

mW

Device power dissipation in detect mode

5

mW

Device power dissipation in sleep mode

15

µW

(1)

The maximum rating is simulated under 3.6V VDD.

4

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