DRV3201-Q1

SLVSBD6 – MAY 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

THERMAL INFORMATION

DRV3201

HTQFP

UNIT

PAP - 64 PINS

Junction-to-ambient thermal resistance

21.6

Junction-to-case (top) thermal resistance

10.9

Junction-to-board thermal resistance

4.5

°C/W

Junction-to-top characterization parameter

0.1

Junction-to-board characterization parameter

4.4

Junction-to-case (bottom) thermal resistance

0.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Copyright © 2012, Texas Instruments Incorporated

Product Folder Link(s): DRV3201-Q1