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CD74HC4017QM96G4Q1 Datasheet(PDF) 2 Page - Texas Instruments |
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CD74HC4017QM96G4Q1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 14 page CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA − OCTOBER 2003 − REVISED APRIL 2008 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagram (positive logic) CE 3 2 4 7 1 6 5 10 0 1 2 3 4 5 6 7 14 13 15 CP MR 9 12 11 8 9 TC Decoded Decimal Out absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) ±20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output clamp current, IOK (VO < −0.5 V or VO > VCC + 0.5 V) ±20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Source or sink current per output pin, IO (VO > −0.5 V or VO < VCC + 0.5 V) ±25 mA . . . . . . . . . . . . . . . . . . . . Continuous current through VCC or GND ±50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2): M package 73 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PW package 108 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 300 °C . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages referenced to GND unless otherwise specified. 2. The package thermal impedance is calculated in accordance with JESD 51-7. |
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