MAX2023_V1 datasheet(2/18 Pages) MAXIM

Part #	MAX2023_V1

Description	High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2500MHz Quadrature Mod/Demod

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Manufacturer	MAXIM [Maxim Integrated Products]

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High-Dynamic-Range, Direct Up-/Downconversion

1500MHz to 2500MHz Quadrature Mod/Demod

2

ABSOLUTE MAXIMUM RATINGS

VCC_ to GND ........................................................-0.3V to +5.5V

BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (VCC + 0.3V)

LO, RF to GND Maximum Current ......................................30mA

RF Input Power ...............................................................+30dBm

Baseband Differential I/Q Input Power ..........................+20dBm

LO Input Power...............................................................+10dBm

RBIASLO1 Maximum Current .............................................10mA

RBIASLO2 Maximum Current .............................................10mA

RBIASLO3 Maximum Current .............................................10mA

Continuous Power Dissipation (Note 1) ...............................7.6W

Operating Case Temperature Range (Note 2) ....-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

DC ELECTRICAL CHARACTERISTICS

(MAX2023

Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50

Ω to GND, LO input terminated into

50

Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C, unless otherwise

noted. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.)

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

4.75

5.00

5.25

V

Supply Current

(Note 5)

255

295

345

mA

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1:

Based on junction temperature TJ = TC + (

θJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the

Applications Information section for details.

The junction temperature must not exceed +150°C.

Note 2:

TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Note 3:

Junction temperature TJ = TA + (

θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 4:

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS

TQFN

Junction-to-Ambient

Thermal Resistance (

θJA) (Notes 3, 4) .......................+34°C/W

Junction-to-Case

Thermal Resistance (

θJC) (Notes 1, 4) ......................+8.5°C/W

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

RF Frequency (Note 6)

fRF

1500

2500

MHz

LO Frequency (Note 6)

fLO

1500

2500

MHz

IF Frequency (Note 6)

fIF

1000

MHz

LO Power Range

PLO

-3

+3

dBm

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