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MAX2023_V1 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX2023_V1 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 18 page High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2500MHz Quadrature Mod/Demod 2 ABSOLUTE MAXIMUM RATINGS VCC_ to GND ........................................................-0.3V to +5.5V BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (VCC + 0.3V) LO, RF to GND Maximum Current ......................................30mA RF Input Power ...............................................................+30dBm Baseband Differential I/Q Input Power ..........................+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current .............................................10mA RBIASLO2 Maximum Current .............................................10mA RBIASLO3 Maximum Current .............................................10mA Continuous Power Dissipation (Note 1) ...............................7.6W Operating Case Temperature Range (Note 2) ....-40°C to +85°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C DC ELECTRICAL CHARACTERISTICS (MAX2023 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50 Ω to GND, LO input terminated into 50 Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage 4.75 5.00 5.25 V Supply Current (Note 5) 255 295 345 mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Based on junction temperature TJ = TC + ( θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Note 3: Junction temperature TJ = TA + ( θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PACKAGE THERMAL CHARACTERISTICS TQFN Junction-to-Ambient Thermal Resistance ( θJA) (Notes 3, 4) .......................+34°C/W Junction-to-Case Thermal Resistance ( θJC) (Notes 1, 4) ......................+8.5°C/W RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency (Note 6) fRF 1500 2500 MHz LO Frequency (Note 6) fLO 1500 2500 MHz IF Frequency (Note 6) fIF 1000 MHz LO Power Range PLO -3 +3 dBm |
Similar Part No. - MAX2023_V1 |
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Similar Description - MAX2023_V1 |
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