Document Number: 38-05446 Rev. *L

Page 5 of 19

Capacitance

Parameter [11]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Parameter [11]

Description

Test Conditions

48-ball VFBGA

(6 x 8 x 1mm)

48-pin TSOP I

Unit



JA

Thermal resistance

(Junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

two-layer printed circuit board

55

60

°C/W



JC

Thermal resistance

(Junction to case)

16

4.3

°C/W

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

V

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

R1

Parameters

2.2 V to 2.7 V

2.7 V to 3.6 V

Unit

R1

16667

1103



R2

15385

1554



8000

645



1.20

1.75

V

Note

11. Tested initially and after any design or process changes that may affect these parameters.