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CY7C1440AV33-250AXC Datasheet(PDF) 6 Page - Cypress Semiconductor

Part # CY7C1440AV33-250AXC
Description  36-Mbit (1 M 횞 36) Pipelined Sync SRAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1440AV33-250AXC Datasheet(HTML) 6 Page - Cypress Semiconductor

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CY7C1440AV33
Document Number: 38-05383 Rev. *K
Page 6 of 33
Pin Definitions
Name
I/O
Description
A0, A1, A
Input-
synchronous
Address inputs used to select one of the address locations. Sampled at the rising edge of the CLK
if ADSP or ADSC is active LOW, and CE1, CE2, and CE3[1]are sampled active. A1:A0 are fed to the
two-bit counter.
BWA, BWB,
BWC, BWD
Input-
synchronous
Byte write select inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled
on the rising edge of CLK.
GW
Input-
synchronous
Global write enable input, active LOW. When asserted LOW on the rising edge of CLK, a global write
is conducted (all bytes are written, regardless of the values on BWX and BWE).
BWE
Input-
synchronous
Byte write enable input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted
LOW to conduct a byte write.
CLK
Input-
clock
Clock input. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV is asserted LOW, during a burst operation.
CE1
Input-
synchronous
Chip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a
new external address is loaded.
CE2
Input-
synchronous
Chip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1
and CE3 to select/deselect the device. CE2 is sampled only when a new external address is loaded.
CE3
Input-
synchronous
Chip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
and CE2 to select/deselect the device. Not available for AJ package version. Not connected for BGA.
Where referenced, CE3 is assumed active throughout this document for BGA. CE3 is sampled only when
a new external address is loaded.
OE
Input-
asynchronous
Output enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW,
the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data
pins. OE is masked during the first clock of a read cycle when emerging from a deselected state.
ADV
Input-
synchronous
Advance input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
automatically increments the address in a burst cycle.
ADSP
Input-
synchronous
Address strobe from processor, sampled on the rising edge of CLK, active LOW. When asserted
LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is
ignored when CE1 is deasserted HIGH.
ADSC
Input-
synchronous
Address strobe from controller, sampled on the rising edge of CLK, active LOW. When asserted
LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized.
ZZ
Input-
asynchronous
ZZ “sleep” input, active HIGH. When asserted HIGH places the device in a non-time-critical “sleep”
condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ
pin has an internal pull-down.
DQs,
DQPX
I/O-
synchronous
Bidirectional data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the
addresses presented during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQPX
are placed in a tri-state condition.
VDD
Power supply Power supply inputs to the core of the device.
VSS
Ground
Ground for the core of the device.
VSSQ
I/O ground
Ground for the I/O circuitry.
Note
1. X = “Don't Care.” H = Logic HIGH, L = Logic LOW.


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