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MPXA6115A6T1 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc |
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MPXA6115A6T1 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 17 page MPXA6115A Sensors 6 Freescale Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Figure 5. SOP Footprint (Case 482) Figure 6. SSOP Footprint (Case 1317 and 1317A) 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 2.54 0.300 7.62 inch mm 0.100 TYP 8X 2.54 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 TYP |
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