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D-300-03 Datasheet(PDF) 1 Page - PANDUIT CORP.

Part No. D-300-03
Description  CAP, SPLICE ENCAPSULATION
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Maker  PANDUIT [PANDUIT CORP.]
Homepage  http://www.panduit.com
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SPECIFICATION CONTROL DRAWING
307 Constitution Drive Menlo Park, CA 94025, USA
Wire and
Harnessing
Products
TITLE :
CAP, SPLICE ENCAPSULATION
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS.
INCHES DIMENSIONS ARE BETWEEN BRACKETS.
DOCUMENT NO.:
D-300-01/-03
TOLERANCES:
0.00 N/A
0.0 N/A
0 N/A
ANGLES: N/A
ROUGHNESS IN
MICRON
Tyco Electronics reserves the right to amend
this drawing at any time. Users should
evaluate the suitability of the product for
their application.
DCR NUMBER:
D010043
REPLACES:
N/A
DRAWN BY:
M. FORONDA
DATE:
15-Feb.-01
PROD. REV.
SEE TABLE
DOC ISSUE:
1
SCALE:
None
SIZE:
A
SHEET:
1 of 7
If this document is printed it becomes uncontrolled. Check for the latest revision.
Product Dimensions
Product Rev
As Received
After Free Recovery
Maximum
Weight
Product
Name
A±2.54
(A±0.100)
øB
min
W
min
øB
max
W
min
Pounds/mpc
D-300-01
E
25.40
(1.000)
4.45
(0.175)
0.25
(0.010)
2.03
(0.080)
0.76
(0.030)
1.15
D-300-02
E
27.90
(1.100)
6.35
(0.250)
0.38
(0.015)
3.05
(0.120)
1.02
(0.040)
2.55
D-300-03
E
33.02
(1.300)
9.14
(0.360)
0.38
(0.015)
4.57
(0.180)
1.27
(0.050)
4.50
MATERIALS
1. MOLDED CAP: Heat-shrinkable, cross-linked, flame-retarded modified polyolefin.
2. MELTABLE RING: Modified thermoplastic.
APPLICATION
1. These parts are designed to meet the requirements as shown in the Requirements Section when tested as listed.
2. Parts to be assembled as outlined herein.
3. “B” recovered is the maximum inside diameter of the heat-shrinkable cap.
4. “W” is the wall thickness of the heat-shrinkable cap only, and is measured along the vertical wall.
5. “A” is the average length of the cap and is equal to (A min + A max)/2.
1.0
SCOPE
This document covers the requirements and test procedures applicable to heat shrinkable, stub-splice
encapsulation cap (caps) and the molded component thereof.
2.0
APPLICABLE DOCUMENTS
The specifications and standards referenced herein shall form part of this specification to the extent
specified.




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