LTC3226

4

3226fa

unless otherwise noted.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

LDO

Minimum CPO Voltage for LDO Operation

2.4

V

LDO FB Servo Voltage

l

0.76

0.8

0.82

V

2.7

mV/A

200

mΩ

l

–60

60

nA

LDO Current Limit

24

A

RST_FB, RST

RST_FB Threshold (Falling Edge)

l

0.72

0.74

0.76

V

20

mV

l

–50

50

nA

RST Output Low Voltage

65

mV

RST High Impedance Leakage Current

l

1μA

RST Delay (RST_FB Rising)

290

ms

Power-Fail Comparator

PFI Input Threshold (Falling Edge)

l

1.175

1.2

1.225

V

PFI input Hysteresis

20

mV

PFI Input Leakage Current

l

–50

50

nA

PFO Output Low Voltage

65

mV

PFO High Impedance Leakage Current

l

1μA

PFI Delay to PFO (PFI Falling)

0.5

μs

EN_CHG

Input High Voltage

l

1.3

V

Input Low Voltage

l

0.4

V

Input High Current

l

–1

1

μA

Input Low Current

l

–1

1

μA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a thermal resistance much greater than

58.7°C/W.

The LTC3226E is guaranteed to meet specifications from 0°C to 85°C

junction temperature. Specifications over the –40°C to 125°C operating

junction temperature range are assured by design, characterization and

correlation with statistical process controls. The LTC3226I is guaranteed

over the full –40°C to 125°C operating junction temperature range. The

Note that the maximum ambient temperature consistent with these

specifications is determined by specific operating conditions in

conjunction with board layout, the rated thermal package thermal

resistance and the environmental factor.