NX3P191

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 2 — 4 November 2011

2 of 15

NXP Semiconductors

NX3P191

Logic controlled high-side power switch

4.

Ordering information

5.

Marking

6.

Functional diagram

7.

Pinning information

7.1 Pinning

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

NX3P191UK

40 C to +85 C

WLCSP4

wafer level chip-size package; 4 bumps; body

0.76

 0.76  0.51 mm. (Backside Coating

included)

NX3P190/NX3P191

Table 2.

Marking codes

Type number

Marking code

NX3P191UK

x1

Fig 1.

Logic symbol

Fig 2.

Logic diagram (simplified schematic)

001aao342

EN

VIN

VOUT

aaa-000036

LEVEL SHIFT,

SLEW RATE CONTROL

AND LOAD DISCHARGE

EN

Rpd

Rdch

VIN

VOUT

Fig 3.

Pin configuration for WLCSP4

Fig 4.

Ball mapping for WLCSP4

bump A1

index area

12

A

B

aaa-000037

Transparent top view

NX3P191

12

VIN

VOUT

EN

GND

A

B

001aao345

Transparent top view