TLC59711

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SBVS181

– OCTOBER 2011

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

MIN

MAX

Supply voltage

VCC

–0.3

+18

V

IREF

–0.3

VREG + 0.3

V

Input voltage

SDTI, SCKI

–0.3

VREG + 0.6

V

OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3

–0.3

+18

V

Output voltage

SDTO, SCKO

–0.3

VREG + 0.3

V

VREG

–0.3

+6

V

OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3

75

mA

Output current (DC)

VREG

–30

mA

Operating junction temperature

+150

°C

Storage temperature

–55

+150

°C

Human body model (HBM)

4

kV

Electrostatic discharge rating

Charged device model (CDM)

2

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

THERMAL INFORMATION

TLC59711

PWP

UNITS

20 PINS

Junction-to-ambient thermal resistance

68.6

Junction-to-case (top) thermal resistance

44.2

Junction-to-board thermal resistance

19.3

°C/W

Junction-to-top characterization parameter

2.7

Junction-to-board characterization parameter

15.7

Junction-to-case (bottom) thermal resistance

1.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright

© 2011, Texas Instruments Incorporated

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