bq24153A, bq24156A

bq24158, bq24159

SLUSAB0A

– OCTOBER 2010 – REVISED FEBRUARY 2012

www.ti.com

PART NUMBER

MARKING

MEDIUM

QUANTITY

bq24153AYFFR

bq24153A

Tape and Reel

3000

bq24153AYFFT

bq24153A

Tape and Reel

250

bq24156AYFFR

bq24156A

Tape and Reel

3000

bq24156AYFFT

bq24156A

Tape and Reel

250

bq24158YFFR

bq24158

Tape and Reel

3000

bq24158YFFT

bq24158

Tape and Reel

250

bq24159YFFR

bq24159

Tape and Reel

3000

bq24159YFFT

bq24159

Tape and Reel

250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

over operating free-air temperature range (unless otherwise noted)

bq24153A/6A/8/9

UNIT

–2 to 20

V

SCL, SDA, OTG, SLRST, CSIN, CSOUT,

–0.3 to 7

V

CD

PMID, STAT

–0.3 to 20

V

VREF

7

V

SW, BOOT

–0.7 to 20

V

±7

V

-0.3 to 7

V

-7 to 0.7

V

-0.7 to 20

V

Output sink

STAT

10

mA

Output Current (average)

SW

A

Operating free-air temperature range

–30 to 85

°C

Junction temperature

–40 to 125

°C

Storage temperature

–45 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

(2)

Duty cycle for output current should be less than 50% for 10- year life time when output current is above 1.25A.

(3)

All voltages are with respect to PGND if not specified. Currents are positive into, negative out of the specified terminal, if not specified.

Consult Packaging Section of the data sheet for thermal limitations and considerations of packages.

THERMAL INFORMATION

YFF

UNITS

20 PINS

Junction-to-ambient thermal resistance

85

Junction-to-case (top) thermal resistance

25

Junction-to-board thermal resistance

55

°C/W

Junction-to-top characterization parameter

4

Junction-to-board characterization parameter

50

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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Product Folder Link(s): bq24153A bq24156A bq24158 bq24159