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AFE5803ZCF Datasheet(PDF) 3 Page - Texas Instruments |
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AFE5803ZCF Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 52 page  AFE5803 www.ti.com SLOS763A – JANUARY 2012 – REVISED JANUARY 2012 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT MIN MAX AVDD –0.3 3.9 V AVDD_ADC –0.3 2.2 V Supply voltage range AVDD_5V –0.3 6 V DVDD –0.3 2.2 V Voltage between AVSS and LVSS –0.3 0.3 V Voltage at analog inputs and digital inputs –0.3 min [3.6,AVDD+0.3] V Peak solder temperature(2) 260 °C Maximum junction temperature (TJ), any condition 105 °C Storage temperature range –55 150 °C Operating temperature range 0 85 °C Human Body Model (HBM) 2000 V ESD Ratings Charged Device Model (CDM) 500 V (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions " is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability. (2) Device complies with JSTD-020D. THERMAL INFORMATION AFE5803 THERMAL METRIC(1) BGA UNITS 135 PINS θJA Junction-to-ambient thermal resistance 34.1 θJCtop Junction-to-case (top) thermal resistance 5 θJB Junction-to-board thermal resistance 11.5 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 10.8 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN MAX UNIT AVDD 3.15 3.6 V AVDD_ADC 1.7 1.9 V DVDD 1.7 1.9 V AVDD_5V 4.75 5.5 V Ambient Temperature, TA 0 85 °C Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): AFE5803 |
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